edf1am thru EDF1DM vishay semiconductors formerly general semiconductor document number 88577 www.vishay.com 18-mar-02 1 miniature glass passivated ultrafast bridge rectifier reverse voltage 50 and 200v forward current 1.0a maximum ratings & thermal characteristics ratings at 25? ambient temperature unless otherwise specified. parameter symbol edf1am edf1bm edf1cm EDF1DM unit maximum repetitive peak reverse voltage v rrm 50 100 150 200 v maximum rms voltage v rms 35 70 106 140 v maximum dc blocking voltage v dc 50 100 150 200 v maximum average forward output rectified current at t a = 40? i f(av) 1.0 a peak forward surge current single half sine-wave super- imposed on rated load (jedec method) t j = 150? i fsm 50 a rating for fusing (t < 8.3ms) i 2 t10a 2 sec typical thermal resistance per leg (note 1) r ja 38 r jl 12 ?/w operating junction and storage temperature range t j , t stg 55 to +150 ? electrical characteristics ratings at 25? ambient temperature unless otherwise specified. parameter symbol edf1am edf1bm edf1cm EDF1DM unit max. instantaneous forward voltage drop per leg at 1.0a v f 1.05 v maximum reverse current t a = 25? 5.0 a at rated dc blocking voltage t a = 125? i r 1.0 ma maximum reverse recovery time at i f = 0.5a, i r = 1.0a, i rr = 0.25a t rr 50 ns note: (1) thermal resistance from junction to ambient and from junction to lead mounted on p.c.b. with 0.51 x 0.51" (13 x 13mm) copper pads 0.315 (8.00) 0.285 (7.24) 0.013 (3.3) 0.0086 (0.22) 0.350 (8.9) 0.300 (7.6) 0.255 (6.5) 0.245 (6.2) 0.335 (8.51) 0.320 (8.12) 0.045 (1.14) 0.035 (0.89) 0.080 (2.03) 0.050 (1.27) 0.023 (0.58) 0.018 (0.46) 0.185 (4.69) 0.150 (3.81) 0.130 (3.3) 0.120 (3.05) 0.075 (1.90) 0.055 (1.39) 0.205 (5.2) 0.195 (5.0) dimensions in inches and (millimeters) features plastic package used has underwriters laboratory flammability classification 94v-0 this series is ul listed under recognized component index, file number e54214 glass passivated chip junction high forward surge current capability ideal for printed circuit boards superfast recovery times for high efficiency high temperature soldering guaranteed: 260 c/10 seconds, at 5 lbs. (2.3kg) tension mechanical data case: molded plastic body over passivated junctions terminals: plated leads solderable per mil-std-750, method 2026 polarity: polarity symbols as marked on body mounting position: any weight: 0.014 oz., 0.4 g packaging codes/options: 45/50 ea. per bulk tube case style dfm
20 40 60 80 100 120 140 160 0 0.5 1.0 1 10 100 0 10 20 30 40 50 60 0.4 0.6 0.8 1.0 1.2 1.4 0.01 0.1 1 10 0 20 40 60 80 100 0.1 1 10 100 1,000 1 0.1 10 100 200 10 5.0 0 15 20 25 30 fig. 5 - typical junction capacitance per leg junction capacitance (pf) reverse voltage (v) t j = 25 c f = 1.0 mhz vsig = 50mvp-p 1.0 cycle 60 h z resistive or inductive load p.c.b. mounted on 0.51 x 0.51" (13 x 13mm) copper pads with 0.06" (1.5mm) lead length fig. 3 - typical forward characteristics per leg instantaneous forward current (a) instantaneous forward voltage (v) t j = 25 c pulse width = 300 s 1% duty cycle fig. 1 - derating curves output rectified current average forward output current (a) ambient temperature ( c) fig. 2 - maximum non-repetitive peak forward surge current peak forward surge current (a) number of cycles at 60 hz t j = 150 c single sine-wave (jedec method) fig. 4 - typical reverse leakage characteristics per leg instantaneous reverse leakage current ( a) percent of rated peak reverse voltage (%) t j = 125 c t j = 25 c 0.75 0.25 capacitive loads i pk / i av = 5.0 i pk / i av = 10 i pk / i av = 20 edf1am thru EDF1DM vishay semiconductors formerly general semiconductor www.vishay.com document number 88577 2 18-mar-02 ratings and characteristic curves (t a = 25 c unless otherwise noted)
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